Assembly

SMT components: Pick and place lines
Inspection: AOI (Automatic optical inspection)
Electric functional test
Incircuit test
Dynamic endurance test (T-change, climatic etc.)
Bare dies: Die bonding (glueing, soldering)
Wire bonding (Au, Al)
Flip Chip
Globe top encapsulation (epoxi, silicon)

If you have technical questions about this topic or need a custom solution, our employees will naturally help you by phone at +49 09103 5070 or by e-mail at sales@siegert.de.