© 2002 SIEGERT electronic GmbH
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What
can you expect from us?
| LAYOUT,
DESIGN |
| CAD
stations for hybrid and PCB layouts (Graffy, Eagle) |
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| SCREEN
PRINTING |
4
fully automized printing lines
6 semi automized printing lines |
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| FIRING |
| 4
firing furnaces |
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| LASER
TRIMMING |
| Laser
systems for passive and active trimming |
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| ASSEMBLY |
3
pick and place lines including convection and nitrogen
reflow furnaces
semi automized and automized solder cream printers for
high volumes including loading and unloading
Dual in line, single in line
Solder dipping
Cleaning equipment
Wave soldering (400 mm)
Visual inspection
Repair stations
Manual pick and place |
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| BONDING |
Automized
Die bonder und wire bonder (Au)
Semi automized Flip Chip bonder
Nitrogen reflow furnace
Manual heavy wire bonder (Al) |
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| PASSIVATION |
| Glob
Top and conformal coating |
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| INTERCONNECTION
TEST |
| Test
station for high pin count for open, shorts, throughholes |
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| ELECTRICAL
TEST |
| Standard
and custom developed test systems, incircuit test |
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| RESEARCH
AND DEVELOPMENT |
| Electrical
tests and simulation, special test equipment, Development
of products, technologies processes and materials |
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| QUALITY
ASSURANCE |
| Chambers
for reliability experiments, cycling, climate, humidity,
visual inspection, high resolution microscopes, different
measurement equipment, preparation of cross sections,
R-drift, TCR |
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| MATERIAL |
| Worldwide
sourcing of material |
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