| SMT components: | Pick and place lines |
| Inspection: | AOI (Automatic optical inspection) Electric functional test Incircuit test Dynamic endurance test (T-change, climatic etc.) |
| Bare dies: | Die bonding (glueing, soldering) Wire bonding (Au, Al) Flip Chip Globe top encapsulation (epoxi, silicon) |
If you have technical questions about this topic or need a custom solution, our employees will naturally help you by phone at +49 09103 5070 or by e-mail at sales@siegert.de.